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Shaanxi KeGu New Material Technology Co., Ltd
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High-Temperature Resistant SiC Forks: Precision Core Components for Semiconductor Manufacturing

Shaanxi KeGu New Material Technology Co., Ltd
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High-Temperature Resistant SiC Forks: Precision Core Components for Semiconductor Manufacturing

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Brand Name : KeGu

Place of Origin : China

Payment Terms : L/C,D/A,D/P,T/T,Western Union,MoneyGram

Supply Ability : 2,000 pcs/month

Packaging Details : Strong wooden box for Global shipping

Model Number : Customizable

Price : 200-500 yuan/kg

Material : SiC

Composition:SiC : >98%

Color : Black

Density : >3.05g/cm3

Max. Service Temp : 1650°C

Flexural Strength : 3800MPa

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Product Description

High-Temperature Resistant Silicon Carbide (SiC) Forks, also known as Pressureless Sintered SiC Robotic Arms, represent a breakthrough in material science for precision automation. Engineered using advanced pressureless sintering technology, these forks deliver unparalleled performance in the most demanding semiconductor manufacturing environments. Composed of high-purity silicon carbide, they offer an exceptional combination of thermal stability, mechanical strength, and corrosion resistance essential for next-generation industrial applications.

Key Properties & Advantages

  • Extreme Temperature Resilience: Withstands operating temperatures up to 1650°C in air, maintaining structural integrity in high-temperature processes.

  • Superior Mechanical Strength: Features high flexural strength (320-400 MPa) from room temperature up to 1300°C, ensuring reliable performance under heavy loads.

  • Exceptional Thermal Management: Offers outstanding thermal conductivity (196 W/m·K at 20°C) combined with low thermal expansion (4.0 x 10⁻⁶/K), providing excellent thermal shock resistance (>350°C).

  • Maximized Durability: Ultra-high hardness (2350 kg/mm² Vickers) and near-zero open porosity ensure exceptional wear resistance and long-term reliability in abrasive environments.

  • Optimized for Precision: High modulus of elasticity (410 GPa) and rigid lightweight design enable minimal deflection and high-precision handling of sensitive substrates like silicon wafers.

Technical Specifications



Physical Properties Unit Value (SSiC)
Composition: SiC Vol% ≥98
Density @ 20°C g/cm³ ≥3.05
Open Porosity Vol% ≈0
Vickers Hardness HV1 kg/mm² 2350
Rockwell Hardness 45N R45N 93
Flexural Strength

- @ 20°C MPa 320-400
- @ 1300°C MPa 300-400
Thermal Conductivity

- @ 20°C W·m⁻¹·K⁻¹ 196
- @ 1200°C W·m⁻¹·K⁻¹ 60
Max. Service Temp (air) °C 1650
Thermal Shock Resistance °C >350
Coefficient of Thermal Expansion 10⁻⁶/K 4.0
Modulus of Elasticity @ RT GPa 410

Critical Application Areas

  • Semiconductor Manufacturing: Ideal for wafer handling, transfer, and processing in CVD, LPCVD, diffusion furnaces, and other high-temperature equipment

  • Advanced Thermal Processing: Essential components for high-temperature industrial furnaces and heat treatment systems

  • Aerospace & Defense: Critical parts requiring thermal stability and lightweight durability

  • Nuclear Energy Systems: Components for demanding radiation and high-temperature environments

  • Precision Automation: Robotic arms and end-effectors for cleanroom and harsh environment applications

Performance Benefits

  • Reduced particle generation and contamination in cleanroom environments

  • Minimal thermal deformation for precise positioning accuracy

  • Extended service life compared to quartz and graphite alternatives

  • Reduced maintenance downtime and increased production throughput

  • Excellent resistance to chemical corrosion from process gases and cleaning agents

These SiC forks are specifically engineered to enhance process reliability and yield in precision manufacturing applications where temperature extremes, chemical resistance, and mechanical stability are critical performance factors.




Product Tags:

Pressureless Sintered SIC Fork

      

Lightweight Sintered SIC Fork

      

High Temperature Resistant SIC Fork

      
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